Wafer-bumping-and-RDL

1Milano,October7,2004WaferBumpingandRedistributionBumping/RedistributionStandardization?ElmarCullmannMilano,October7,2004WaferBumpingandRedistribution2MPU200M46.8%MPU310M13.7%Memory15M3.5%Memory120M5.3%Analog5M1.2%Analog435M19.2%20032008Total:427MUnitsTotal:2,270MUnitsMCU/DSP40M9.4%MCU/DSP625M27.5%Chipset/112M26.2%GraphicsChipset/MPR293M12.9%Logic/ASIC55M12.9%Logic/ASIC350M15.4%WY44.261bp-chipGraphics137M6.0%(CourtesyofPrismarkPartnersLLC)2Milano,October7,2004WaferBumpingandRedistribution3LeadsDiePaddleLeads()OnlyexposedatbottomsideofthepackageWireBondMoldingCompoundsLeadframeDieWireBondMoldingCompoundsLeadframePackageLeadlessPackageDieMilano,October7,2004WaferBumpingandRedistribution4EncapsulantBGASubstrate(flex)AdhesiveDieRadiationPlateWireBondsSolderBallsMetalFrame3Milano,October7,2004WaferBumpingandRedistribution51.passivationlayer2.sputterUBMandcoatresist4.resistdevelopment5.electroplating6.resiststrippingandetchingofplatingbaseGoldBumping3.exposure20µmMilano,October7,2004WaferBumpingandRedistribution625µm1.passivationlayer2.sputterUBMandcoatresist4.electroplating(PbSn)5.resiststripping6.platingbaseetchandreflowSolderBumping(mushroom)3.exposure+development4Milano,October7,2004WaferBumpingandRedistribution7CuSolder70-100µm1.passivationlayer2.sputterUBMandcoatresist4.electroplating(Cu+solder)5.resiststripping6.platingbaseetchandreflowCopperPosts3.exposure+developmentCuSolderMilano,October7,2004WaferBumpingandRedistribution85Milano,October7,2004WaferBumpingandRedistribution9Milano,October7,2004WaferBumpingandRedistribution10PeripheralPackagingvsAreaArray/WL-CSP02004006008001000120014001600100100010000RedistributionFile:peri-arrayPadPitch[µm]NumberofI/Os(max)DieSize:10mm2squareareaarrayperipheralRedistributionInstitutfürZuverlässigkeitundMikrointegrationFraunhofer6Milano,October7,2004WaferBumpingandRedistribution11ŒBCB(Cyclotene)Redistributionlayer+AreaarraysolderbumpsperimeterpadsareaarraypadsredistributionlayerChipScalePackagewithredistributionlayerMilano,October7,2004WaferBumpingandRedistribution121.passivationlayer2.coatdielectricandopenpadsbyphotolithography3.sputterplatingbaseandcoatresist4.printredistribution(photolithography)5.electroplatingandresiststripping6.etchplatingbase,coatdielectricandopenpadPerimeterPadDielectric(PolyimideorBCB)ResistAreaArrayPadDielectric(PolyimideorBCB)Redistribution7Milano,October7,2004WaferBumpingandRedistribution13FCIProcessMilano,October7,2004WaferBumpingandRedistribution14Foto:Woelck/WolfcircuitI/OpadsDielectriclayer(BCB)PbSn60solderballsCourtesyIZM8Milano,October7,2004WaferBumpingandRedistribution15CourtesyIZMMilano,October7,2004WaferBumpingandRedistribution16StandardizationofEdgeExclusionZone?Inprinciplefine,butstronglydependentonphotoresistused(thicknessandtype)