PCB激光钻孔

TechnicalPresentationLaserDrillingTechnologyTechnicalPresentationLaserDrillingTechnologyConfidential&ProprietaryConfidential&ProprietaryJUN.,2002JUN.,2002OfunaEnterpriseCo.,Ltd.大船企業股份有限公司桃園縣龜山鄉華亞科技園區復興三路558號公司電話：[phone]公司傳真：[phone]型號：特性：高速SuperCO2system自動基板交換裝置極佳的操作性；交談式的程式語言自動基板對焦藉由steppulse可實行高速burst加工LCOseries(97LCOseries(97年推出年推出))商品介紹型號：特性：高速、高信賴性SuperCO2藉由steppulse可實行高速burst加工微小pulsewidth安定化控制系統極緻實現量產時的實用性自動基板交換裝置(ABC-1C)NewLCNewLC--1Cseries(991Cseries(99年推出年推出))型號：特性：配合客戶需求推出實驗用及多樣的樣品用的設備孔徑範圍大及採用最新TOPHAT技術達到品質及速度雙贏自動基板交換裝置(ABC-1C)NewLCNewLC--1Cseries(1Cseries(20012001年推出年推出))實驗、樣品用雷射型號：特性：日立原創單雷射頭雙雷射鑽孔機。藉雙雷射實現高產能雷射能量可控制且穩定steppulse可實行高速burst加工自動基板交換裝置(ABC-1C)NewLCNewLC--2Cseries(20012Cseries(2001推出推出))實現量產化的旗艦型號意義LC-1C21E/1CLCL：LASERC：CO21C1：ONEBEAM（2：TWOBEAM）C：CSERIES21作業平台寬度21英吋E註明E者為輸出國外1C自動基板交換裝置ItemLCOseriesLC-1CseriesLC-2CseriesMaximumpanelsize535*690mm535*690mm535*690mmXYpositioningaccuracy+/-0.005mm+/-0.002mm+/-0.002mmLasertypeSuperPulseCO2laser,wavelength9.4μmLaserpulsewidth10to100μsec1to30μsec1to30μsecGalvanoscanarea50*50mm50*50mm50*50mmPowerrequirement3-phase220V50/60Hz18KVA3-phase22050/60Hz18KVA3-phase22050/60Hz18KVA規格比較CO2LaserDrillingMachineApplicationP.C.BoardStructureComputerPCMCIACardCellularPhoneOthersTH,BTH:ByConventionalDrillingTH(ThroughHole)BH(BlindHole)THBTH(BuriedThroughHole)BH}Build-up}Core}Build-up}Build-up}Core}Build-upBH:ByLaserDrillingＱＦＰＢＧＡＣＳＰ(QuadFlatPackage)(BallGridArray)(ChipSizePackage)IC/LSIPackageBuildupPCBStructureBuilduppartCorepartBuilduppartLaserWavelengthEXCIMER(ArF)EXCIMER(KrF)EXCIMER(XeCl)ArIonNd:YAG4thH.ArIonCO2Nd:YAG3rdH.Nd:YAG2ndH.Nd:YAGCO2[nm]InfraredUltraVioletVisible4889400106007001064532248364400308193355266CONFIDENTIALL0E0102A（原理１）908070605040302010035510649400Absorption(%)WavelengthinNanometersCopperDielectricLaserWavelength&AbsorptionGlassCO2LaserUVLaserCONFIDENTIALL0E0103D（原理２）10600GALVANOSCANNERFθLENSAPERTURELASERHEADXYBEAMSHAPINGUNIT・POWER・FREQUENCY・PULSEWIDTH・PULSEMODESCANNINGAREATABLEPOSITIONING・HOLEDIA.CO2LaserOpticalSystem・BEAMSHAPING・SPEED/ACCURACY・FREQUENCY・HOLEPOSITIONACCURACYOPTICALPASS・ENERGYDENSITY・BEAMPOSITIONINGFOCUSINGCONFIDENTIALL0E0509A電路板加工用co2雷射激發源SuperPulseslabmirrorBeamshapermirrorLaseroutput高穩定輸出高可靠性ＲＦ激勵型雷射不需要日常維修•高度連續，短脈衝輸出•不會發生無效激發•高質量光束模式•長壽命•氣體封閉式•不需要定期更換氣體高頻率RF型雷射脈衝周期輸出功率［Ｗ］時間[sec]功率峰值ConformalResinCuLargeWindowLaserDrillingMethodCurrentCurrent：：φφ150150～～125125NextGenerationNextGeneration：：φφ125125～～100100CONFIDENTIALResinDirectCurrentCurrent：：φφ8080NextGenerationNextGeneration：：φφ7575～～6565L1E0132AUV+CO2ＵＶＣＯ２UVLaserDrillingMethodCONFIDENTIALCuDirectL1E0133APatentedConformalmaskConformalResinCuCurrentCurrent：：φφ150150～～125125NextGenerationNextGeneration：：φφ125125～～100100LaserDrillingMethod（１）1.Selectbeamsizeoptimumforwindowdiameter2.ExcessiveEnergy＜BarrelShape＞3.MissregistrationBurstCycleStepPulseL1E0135ALargeWindowLargeWindowResinDirectCurrentCurrent：：φφ8080NextGenerationNextGeneration：：φφ7575～～6565LaserDrillingMethod（２）1.Beamsizedecidesholediameter2.SolutionofMissRegistrationProblem3.FasterDrillingSpeedthanConformalMask4.HoleRoundnessdirectlyeffectedbyBeamShapeStepPulseBurst2shotsPatentedCONFIDENTIALL0E0502BConformalResinCuCurrentCurrent：：φφ150150～～125125NextGenerationNextGeneration：：φφ125125～～100100CONFIDENTIALUV+CO2ＵＶＣＯ２SmallerVia(φ0.1mm)LaserDrillingMethod(3)Subject：TheyieldofconformalwindowgrowworseCuDirectL1E0136ALaserDrillingMethod（3）CuDirectDrilling1.SolutionforMissRegistration2.NowindowisnecessaryHalfEtchingNewthin5μmCopper•CopperSurfaceTreatment•ThinnerCopper•HighEnergyDensityBlackOxidePrep.EtchBondCONFIDENTIALL0E0505ACrossSectionMaterial:MCF-6000E(HitachiChemical)φ75m(3mil)φ100m(4mil)φ125m(5mil)L0E0357B（加工）CONFIDENTIALMaterial:MR500(Mitsui)CrossSectionφ75m(3mil)φ100m(4mil)φ125m(5mil)L0E0356B（加工）CONFIDENTIALMitsuiCrossSectionCu:MITSUIＴＭM75μmdia.(3mil)100μmdia.(4mil)125μmdia.(5mil)L0E0367B（加工）CONFIDENTIALCrossSectionHitachiChemicalCu:MITSUIＴＭM75μmdia.(3mil)100μmdia.(4mil)125μmdia.(5mil)L0E0369B（加工）CONFIDENTIALCrossSectionBirds-eyeViewTopSurfaceCu5μmCuDirectDrillingCONFIDENTIALL0E0585ACONFIDENTIALCrossSectionBirds-eyeViewTopSurfaceCuDirectDrillingCu9μmL0E0583ACONFIDENTIALCrossSectionBirds-eyeViewTopSurfaceCu12μmCuDirectDrillingL0E0584A表面銅箔絕緣層芯材LaserViaQuality雷射加工孔品質的評估要因孔口塌陷裂縫孔壁斜度樹脂殘留，孔底炭化玻璃纖維(FR-4,BT)剝離孔壁粗糙度(RCC)內層銅箔MissRegistrationCauses1.InnerlayerShrink/Expansion2.RegistrationErrorbetweenInnerlayerpadsandOuterlayerwindow(Etchingmask)InnerlayerFiducialHoleRegistrationofOuterlayerScaling(byConformal)Requirementsvs.MissRegistrationCONFIDENTIALL0E0180B（ミスﾚｼﾞ１）CO2LaserX-RayInspectionFiducialMark(Innerlayer)X-RayInspectionPatternEtchingFiducialHoledrillingforEtchingDrillingScalingbyCCDCamera＜PositioningbetweenInnerlayer&Outerlayer＞FiducialMark(Outerlayer)(OuterlayerMaskModification)RegistrationCONFIDENTIALφ0.5～1.0L0E0530AAutoAlignmentinreferencetoInnerlayerFiducialFiducial}Build-up}CoreCO2laserDirectLaserDrillingLargeCopperWindow}Build-up}CoreImprovementregistrationbetweeninnerlayerandout