金线键合封装技术简介

金线键合封装技术简介ASMservice:JiangHaitao2019/12/7ASMPacificTechnologyLtd.©2009page2ContentsBasicIntroductionUnderstandanICPackageICManufacturingFlowWireBondingIntroductionGoldWireBonder焊线封装工艺及分类WIREBOND的基本原理及工艺图示焊线机的工艺机理及基本构架BondingSequenceMaterial&ToolLeadFrameCapillaryGoldWireWindowClamp&TopPlateBondQuality2019/12/7ASMPacificTechnologyLtd.©2009page3Cross-sectionofanICPackage2019/12/7ASMPacificTechnologyLtd.©2009page4ICManufacturingFlow2019/12/7ASMPacificTechnologyLtd.©2009page5GoldWireBonding2019/12/7ASMPacificTechnologyLtd.©2009page6焊线封装工艺焊线封装工艺：用导线将半导体芯片上的电极与外部引脚相连接的工艺，即完成芯片与封装外引脚间的电流通路。BGAQFP2019/12/7ASMPacificTechnologyLtd.©2009page7焊线封装工艺QFNSmartCard2019/12/7ASMPacificTechnologyLtd.©2009page8焊线工艺分类1。热超声/金丝球焊（Thermo-sonicbonding):该工艺利用加热温度和超声能量使被压紧在一起的两种金属界面间形成焊接键合。目前90%以上的半导体封装技术采用该工艺BondingTemperatureisbetween120DegCto240DegC.2。超声楔焊(Ultrasonic):利用超声能量作用于压紧在一起的两种金属间形成键合BondingTemperature=室温3。热压焊（Thermo-compressbonding）:利用加热及压紧力形成键合。该技术1957年在贝尔实验室被使用，是最早的封装工艺技术，但现在已很少在用。BondingTemperature300C.2019/12/7ASMPacificTechnologyLtd.©2009page9热超声焊与超声楔焊比较Thermo-sonicUltrasonicThermo-compress金属线Au/CuAl/AuAu焊线工具CapillaryWedge焊线温度100-240°C室温300-500°C焊线机-电火花放电烧球-不需烧球-焊头与焊线-焊头与焊线无方向要求方向一致NoteLowpressureinultrasonicenergyLowpressureinultrasonicenergyHighpressure,noultrasonicenergy2019/12/7ASMPacificTechnologyLtd.©2009page10BondingParametersWhataretheimportantparametersinGoldWireBonding?Thermo-sonicBondingBondPower(UltrasonicPower,Watt)BondForce(Gramforce)BondTime(ms)BondingTemperature(C)2019/12/7ASMPacificTechnologyLtd.©2009page11BondingPrinciple2019/12/7ASMPacificTechnologyLtd.©2009page12WIREBOND的基本原理2019/12/7ASMPacificTechnologyLtd.©2009page13WIREBOND的基本原理2019/12/7ASMPacificTechnologyLtd.©2009page14金丝球焊工艺图示2019/12/7ASMPacificTechnologyLtd.©2009page15金丝球焊工艺图示(续）2019/12/7ASMPacificTechnologyLtd.©2009page16金丝球焊工艺图示(续）2019/12/7ASMPacificTechnologyLtd.©2009page17金丝球焊工艺图示(续）2019/12/7ASMPacificTechnologyLtd.©2009page18金丝球焊工艺图示(续）2019/12/7ASMPacificTechnologyLtd.©2009page19金丝球焊工艺图示(续）2019/12/7ASMPacificTechnologyLtd.©2009page20金丝球焊工艺图示(续）2019/12/7ASMPacificTechnologyLtd.©2009page21金丝球焊工艺图示(续）2019/12/7ASMPacificTechnologyLtd.©2009page22金丝球焊工艺图示(续）2019/12/7ASMPacificTechnologyLtd.©2009page23金丝球焊工艺图示(续）2019/12/7ASMPacificTechnologyLtd.©2009page24热超声焊工艺机理定义：用导线将半导体芯片上的电极与外部引脚相连接的工艺，即完成芯片与封装外引脚间的电流通路．在焊线制程中，在高温，超声波功率，压力及其他因素的作用下，象金和铝这样相互接触的两种金属发生软化变形，同时两种金属间发生原子扩散形成金属化合物(IntermatellicCompound)或合金(Alloy)，保证焊线键合是可靠的电路连接。2019/12/7ASMPacificTechnologyLtd.©2009page25热超声焊工艺机理2019/12/7ASMPacificTechnologyLtd.©2009page26热超声焊工艺机理2019/12/7ASMPacificTechnologyLtd.©2009page27热超声焊工艺机理2019/12/7ASMPacificTechnologyLtd.©2009page28热超声焊工艺机理2019/12/7ASMPacificTechnologyLtd.©2009page29自动焊线机之主要组成2019/12/7ASMPacificTechnologyLtd.©2009page30热超声焊线机基本构架2019/12/7ASMPacificTechnologyLtd.©2009page31热超声焊线机基本构架2019/12/7ASMPacificTechnologyLtd.©2009page32BondingSequence2019/12/7ASMPacificTechnologyLtd.©2009page33BondingSequence2019/12/7ASMPacificTechnologyLtd.©2009page34BondingSequence2019/12/7ASMPacificTechnologyLtd.©2009page35BondingSequence2019/12/7ASMPacificTechnologyLtd.©2009page36BondingSequence2019/12/7ASMPacificTechnologyLtd.©2009page37BondingSequence2019/12/7ASMPacificTechnologyLtd.©2009page38BondingSequence2019/12/7ASMPacificTechnologyLtd.©2009page39BondingSequence2019/12/7ASMPacificTechnologyLtd.©2009page40BondingSequence2019/12/7ASMPacificTechnologyLtd.©2009page41BondingSequence2019/12/7ASMPacificTechnologyLtd.©2009page42BondingSequence2019/12/7ASMPacificTechnologyLtd.©2009page43BondingSequence2019/12/7ASMPacificTechnologyLtd.©2009page44BondingSequence2019/12/7ASMPacificTechnologyLtd.©2009page45BondingSequence2019/12/7ASMPacificTechnologyLtd.©2009page46BondingSequence2019/12/7ASMPacificTechnologyLtd.©2009page47BondingSequence2019/12/7ASMPacificTechnologyLtd.©2009page48BondingSequence2019/12/7ASMPacificTechnologyLtd.©2009page49BondingSequence2019/12/7ASMPacificTechnologyLtd.©2009page50BondingSequence2019/12/7ASMPacificTechnologyLtd.©2009page51BondingSequence2019/12/7ASMPacificTechnologyLtd.©2009page52BondingSequence2019/12/7ASMPacificTechnologyLtd.©2009page53BondingSequence2019/12/7ASMPacificTechnologyLtd.©2009page54BondingSequence2019/12/7ASMPacificTechnologyLtd.©2009page55BondingSequence2019/12/7ASMPacificTechnologyLtd.©2009page56Material&Tools2019/12/7ASMPacificTechnologyLtd.©2009page57Material&Tools2019/12/7ASMPacificTechnologyLtd.©2009page58Material&Tools2019/12/7ASMPacificTechnologyLtd.©2009page59Material&Tools2019/12/7ASMPacificTechnologyLtd.©2009page60Material&Tools2019/12/7ASMPacificTechnologyLtd.©2009page61Material&Tools2019/12/7ASMPacificTechnologyLtd.©2009page62Material&Tools2019/12/7ASMPacificTechnologyLtd.©2009page63Material&Tools2019/12/7ASMPacificTechnologyLtd.©2009page64Material&Tools2019/12/7ASMPacificTechnologyLtd.©2009page65Material&Tools2019/12/7ASMPacificTechnologyLtd.©2009page66Material&Tools2019/12/7ASMPacificTechnologyLtd.©2009page67Material&Tools2019/12/7ASMPacificTechnologyLtd.©2009page68Material&Tools2019/12/7A